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EFD Software Improves Thermal Conductivity Simulations

Version 8.1 of the Engineering Fluid Dynamics (EFD) simulation software contains many enhancements, including simulation of "Joule heating," plus new "compact" models for IC components, heat pipes and thermoelectric coolers. The new Joule heating model enables automatic determination of heat sources in conducting objects as they heat up due to electric current passing through them. Compact models use a two-resistor approach to represent thermal characteristics of IC packages realistically and efficiently. The treatment of thermal conductivity in printed-circuit boards has been improved and extended. Simulation of fans has also been improved with radial and swirl components of velocity as well as the fan performance curve now fully accounted for. Fans and heat sources can be switched on or off at specified times, temperatures or other specified engineering goals.
Flomerics Inc.
4 Mount Royal Ave., Suite 450
Marlborough, MA, 01752